產品介紹
愛賽克底部填充膠39-ICH08_UNDERFILL
愛賽克底部填充膠39-ICH08_use for low temperature solder product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.
39-ICH08_愛賽克底部填充膠特長：
Liquid state
Property Typical Value Test Condition
Chemical Epoxy (Black)
Specific Gravity @25度
Thixotropic index 12s-1/120s-1
Viscosity mPa·s Cone plate type, 120s-1
Cured state
Property Typical Value Test Condition
Tensile Modulus Gpa 25度, DMA
Tg 120度 DMS
CTE α1/α2 39/105 ppm/度 TMA
Tensile shear strength 16 Mpa JIS K 6850
Volume resistivity x 1015Ω·cm JIS K 6911
Surface resistivity x 1015Ω JIS K 6911
愛賽克UNDERFILL底部填充膠39-ICH08相關產品：
衡鵬供應
愛賽克UNDERFILL底部填充膠39-ICH09
