產品介紹
GNX200BP晶圓減薄/晶圓拋光 衡鵬供應
——又稱晶圓研磨（Wafer Grinding）
GNX200BP晶圓減薄/晶圓拋光概要
GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2.
GNX200BP晶圓減薄/晶圓拋光相關產品：
衡鵬供應
GDM300晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding
